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01108nam a2200337 i 4500 |
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NSK01000740755 |
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HR-ZaNSK |
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20210125132119.0 |
| 007 |
ta |
| 008 |
100723s1999 xxua 001 0deng |
| 020 |
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|a 0849396247
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| 035 |
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|a (HR-ZaNSK)000740755
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|a HR-ZaNSK
|b hrv
|c HR-ZaNSK
|e ppiak
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| 044 |
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|a xxu
|a xxk
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| 080 |
1 |
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|a 621.38.04(035)
|2 2011
|
| 080 |
1 |
|
|a (035)
|2 2011
|
| 100 |
1 |
|
|a Pecht, Michael G.
|
| 245 |
1 |
0 |
|a Guidebook for managing silicon chip reliability /
|c Michael G. Pecht, Riko Radojcic, Gopal Rao.
|
| 260 |
|
|
|a Boca Raton [etc.] :
|b CRC Press,
|c cop. 1999.
|
| 300 |
|
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|a 214 str. :
|b ilustr., graf. prikazi ;
|c 25 cm.
|
| 490 |
0 |
|
|a Electronic packaging series
|
| 500 |
|
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|a Puno ime 3. autora: Gopal K. Rao.
|
| 504 |
|
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|a Bibliografija: str. 199-212.
|
| 504 |
|
|
|a Kazalo.
|
| 505 |
8 |
|
|a Bilješka o autorima: str. [V-VI].
|
| 650 |
|
7 |
|a Integrirani sklopovi
|v Priručnici
|2 nskps
|
| 650 |
|
7 |
|a Poluvodiči
|v Priručnici
|2 nskps
|
| 700 |
1 |
|
|a Radojcic, Riko
|
| 700 |
1 |
|
|a Rao, Gopal K.
|
| 760 |
1 |
|
|t Electronic packaging series
|
| 998 |
|
|
|m nmrk1101
|c rjko110214
|c dvoi2101
|
