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00978nam a2200289 i 4500 |
| 001 |
NSK01000855227 |
| 003 |
HR-ZaNSK |
| 005 |
20210126101610.0 |
| 007 |
ta |
| 008 |
130920s2011 vp ad 001 0 eng |
| 020 |
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|a 9780071741958
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| 035 |
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|a (HR-ZaNSK)000855227
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| 040 |
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|a HR-ZaNSK
|b hrv
|c HR-ZaNSK
|e ppiak
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| 080 |
1 |
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|a 621.3.04
|2 2011
|
| 080 |
1 |
|
|a 621.382
|2 2011
|
| 245 |
0 |
0 |
|a 3D IC stacking technology /
|c Banqiu Wu, Ajay Kumar, Sesh Ramaswami.
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| 246 |
3 |
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|a Three-dimensional integrated circuit stacking technology
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| 260 |
|
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|a New York [etc.] :
|b McGraw Hill,
|c cop. 2011.
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| 300 |
|
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|a XVIII, 521 str. :
|b ilustr. (pretežno u bojama), graf. prikazi u bojama ;
|c 24 cm.
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| 504 |
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|a Bibliografija uz svaki rad.
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| 504 |
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|a Kazalo.
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| 650 |
|
7 |
|a Trodimenzionalni integrirani sklopovi
|2 nskps
|
| 650 |
|
7 |
|a Mikroelektronika
|2 nskps
|
| 700 |
1 |
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|a Wu, Banqiu
|4 edt
|
| 700 |
1 |
|
|a Kumar, Ajay
|4 edt
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| 700 |
1 |
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|a Ramaswami, Sesh
|4 edt
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| 998 |
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|m nmrk1309
|c mzoo131029
|c dvoi2101
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