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130520s2012 ci | |||| ||eng |
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|a (HR-ZaNSK)000859228
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|a HR-ZaNSK
|b hrv
|c HR-ZaNSK
|e ppiak
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|a eng
|b hrv
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|a croatica
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| 044 |
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|a ci
|c hr
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| 080 |
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|a 621
|2 MRF 1998.
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| 080 |
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|a 669
|2 MRF 1998.
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| 100 |
1 |
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|a Šimeková, Beatá
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| 245 |
1 |
0 |
|a Growth of the IMC at the interface of SnAgCuBi (Bi = 0,5; 1,0) solder joints with Cu substrate /
|c Beáta Šimeková, Erika Hodúlová, Ingrid Kovaříková, Marián Palcut, Koloman Ulrich.
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| 246 |
3 |
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|a InterMetallic Compounds
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| 300 |
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|b Ilustr.
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| 504 |
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|a Bibliografija: 12 jed.
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| 504 |
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|a Sažetak
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| 653 |
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0 |
|a Lemljenje
|a Intermetalni spojevi
|a Žarenje
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| 700 |
1 |
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|a Hodúlová, Erika
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| 700 |
1 |
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|a Kovařiková, Ingrid
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| 700 |
1 |
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|a Palcut, Marián
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| 700 |
1 |
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|a Ulrich, Koloman
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| 773 |
0 |
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|t Tehnički vjesnik (Strojarski fakultet)
|x 1330-3651
|g 19 (2012) 1 ; str. 107-110
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| 981 |
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|b B08/12
|p CRO
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| 998 |
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|a rpeo131023
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| 856 |
4 |
2 |
|u http://hrcak.srce.hr/index.php?show=clanak&id_clanak_jezik=117644
|y Elektronička verzija članka
|