|
|
|
|
| LEADER |
01063naa a2200289 i 4500 |
| 001 |
NSK01001087697 |
| 003 |
HR-ZaNSK |
| 005 |
20210122131257.0 |
| 007 |
ta |
| 008 |
210122s2018 ci | |0|| ||eng |
| 035 |
|
|
|a (HR-ZaNSK)001087697
|
| 040 |
|
|
|a HR-ZaNSK
|b hrv
|c HR-ZaNSK
|e ppiak
|
| 042 |
|
|
|a croatica
|
| 044 |
|
|
|a ci
|c hr
|
| 080 |
1 |
|
|a 621.3
|2 2011
|
| 080 |
1 |
|
|a 51
|2 2011
|
| 100 |
1 |
|
|a Zhang, Yuanxiang
|4 aut
|9 HR-ZaNSK
|
| 245 |
1 |
4 |
|a The effects of grain structure on electromigration failure of the lead-free solder bump /
|c Yuanxiang Zhang, Lihua Liang, Dongdong Zhu.
|
| 300 |
|
|
|b Ilustr.
|
| 504 |
|
|
|a Bibliografija: 22 jed.
|
| 653 |
|
0 |
|a Poluvodički elektronički elementi
|a Čip multiprocesori
|a FEM
|a Metoda konačnih elemenata
|
| 700 |
1 |
|
|a Liang, Lihua
|4 aut
|9 HR-ZaNSK
|
| 700 |
1 |
|
|a Zhu, Dongdong
|4 aut
|9 HR-ZaNSK
|
| 773 |
0 |
|
|t International journal for engineering modelling
|x 1330-1365
|g 31 (2018), 3 ; str. 79-93
|w nsk.(HR-ZaNSK)000012407
|
| 981 |
|
|
|b B07/18
|
| 998 |
|
|
|b rpeo2101
|
| 856 |
4 |
1 |
|u https://hrcak.srce.hr/218244
|y Elektronička verzija članka
|